◆ PC基板程序
◆ 简单操作
◆ 较高的准确性
◆ Dicing saw 是切割機為使用切割刀片針對矽・玻璃・陶瓷等被加工物進行高精度切割的裝置。
應用領域
◆ PCB
◆ Silicon wafer
Model | Unit | ADS-200 | |
Max. workpiece size | mm | Ø200 | |
X-axis | Usable stroke | mm | 200 |
Cut speed | mm | 0.1~400 | |
Y-axis | Usable Stroke | mm/sec | 210 |
Resolution | mm | 0.0001 | |
Indexing accuracy | mm | 0.002 | |
(Single pitch) | mm | ||
Indexing accuracy | mm | 0.005/210 | |
(Cumulative pitch) | mm | ||
indexong Step | mm | 0.0001 | |
Z-axis | Usable stroke | mm | 40 |
(For 2"blade) | mm | ||
Resolution | mm | 0.0001 | |
Repeating accuracy | mm | 0.001 | |
Blade size | mm | 52 or 76.2 | |
θ-axis | Rotation angle | Deg. | 100 or 380(Option) |
Spindle | Power | kW | 2.2 |
RPM | rpm | 50,000 | |
Vision Unit | Manual or Auto(Option) alignment system | ||
Dimension(W*D*H) | 750*975*1600 | ||
Weight | 950
|