精度和高达96,000 cph破纪录的贴装速度的独特组合,使得SIPLACE TX micron在大批量和高精度的模块、系统级封装和其他关注微型化的应用中成为毋庸置疑的赢家。
亮点:
- 贴装速度高达96,000 cph
- Placement accuracy 25/20 µm @ 3 sigma down to 15 μm (equipped with vacuum tooling)
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PCB尺寸(长x宽)
双轨:50 mm x 45 mm to 375 mm x 260 mm
With vacuun tooling (for 15 µm): 50 mm x 55 mm to 250 mm x 100 mm
单轨:50 mm x 45 mm to 375 mm x 460 mm - 更小的占地面积:1.00 m x 2.23 m x 1.45 m
- 供料器插槽高达80x 8 mm,Jedec Tray制式料盘
- Semi S2/S8认证,清洁室ISO 7级
- Minimum placement force: 0.5 N for sensitive components
- Touchless placement: Highest placement quality for highly sensitive components
- Linear Dipping Unit with inspection via vision system and auto cavity